Qianli 24k Explosion Proof Gold-Plated Foil Gasket For Chip BGA Soldering

Qianli 24k Explosion Proof Gold-Plated Foil Gasket For Chip BGA SolderingQianli iAtlas 24K explosion proof gold plated foil gasket easy to tin in for reballing precise BGA motherboard repair spacer. Qianli iAtlas 24K gold plated foil gasket 0. 8mm 0. 1mm 0. 12mm for mobile phone motherboard middle frame solder explosion proof. Qianli 24K gold plated foil for iPhone motherboard middle layer frame chips tin planting reballing. Feature: 1. Support middle frame, chips, and BGA. 2. Clamp the foil as easy as falling off a log.

Qianli iAtlas 24K explosion proof gold-plated foil gasket easy to tin in for reballing precise BGA motherboard repair spacer. Qianli iAtlas 24K gold-plated foil gasket 0.8mm 0.1mm 0.12mm for mobile phone motherboard middle frame solder explosion-proof. Qianli 24K gold-plated foil for iPhone motherboard middle layer frame chips tin planting reballing.

Feature:
1. Support middle frame, chips, and BGA.
2. Clamp the foil as easy as falling off a log.
3. The backbone of the precise electronics hardware.
4. Small size and great efficiency, solder explosion-proof.
5. Applied to all electronic components required lamination.
6. More stable alignment, motherboard slight deformation worry-free.
7. 3 kinds of sizes meet various needs with different thicknesses and weights.

How to use:
Efficiency, success rate Only 4 simple steps to complete the implantation of the gasket.
Step 1: Filling with tin stencil.
Step 2: Use tweezers to remove the spacer.
Step 3: Place the Pad on the Pad Paste.
Step 4: Melt the tin paste on the pad to fix the gasket and use it.

Wide range of use:
The middle frame, chip, BGA, and electronic components that need to be attached can all be used.

Packing includes:
0.08mm *1 bottles
0.1mm *1 bottles
0.12mm *1 bottles